remove picture shortcode

hugo/assets/styles.scss

@@ -32,9 +32,9 @@ a {
   color: inherit;
 }
 
-table {
-  display: none;
-}
+// table {
+//   display: none;
+// }
 
 .visually-hidden {
   position: absolute !important;

hugo/content/analytical-services/c-scanning-acoustic-microscopy.md

@@ -4,17 +4,17 @@ title: C Scanning Acoustic Microscopy
 
 ## Theory of Operation
 
-{{< picture src="diagram9_large" alt="a large diagram ">}}
+![C-SAM](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/diagram9_large.gif 'C Scanning Acoustic Microscope')
 
 The C-SAM works by alternately producing and receiving pulses of ultrasonic energy from 10- 200 MHz. Ultrasound will not transmit through air and the energy produced by an acoustical lens is focused on the acoustical subsurface on planes using water as the medium.
 
 The ultrasound interacts within the solid, and the echoes reflected can be analyzed for information about the sample. Each interface within the sample transmits some ultrasonic energy, and reflects some energy. By compiling these echoes via a computer an image can be produced produced as the transducer is scanned over the sample. The different colors in the enhanced image represent different acoustical planes and topography within the sample.
 
-{{< picture src="csam.h2" alt="csam h2">}}
+![Delamination under die](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/csam.h1.jpg 'Delamination under die')
 
-{{< picture src="csam.h1" alt="csam h1">}}
+![C-SAM](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/csam.h2.jpg 'C Scanning Acoustic Microscope')
 
-{{< picture src="csam.h3" alt="csam h3">}}
+![More delamination](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/csam.h3.jpg 'More delamination')
 
 As a result, any voids, cracks, delaminations, or other "air-filled" disbonds will show extremely high contrast, because the air reflects all of the energy. C-SAM has certain advantages over x-ray inspection (radiography) with the ability to focus at specific levels, it can give information about the size and depth of the defect.
 
@@ -26,3 +26,4 @@ As a result, any voids, cracks, delaminations, or other "air-filled" disbonds wi
 - Ceramic chip capacitors can be inspected for internal cracks and delaminations.
 - Tape automation bonds (TAB) can be evaluated for quality of the attach.
 - Die attach voids (solder, silver filled epoxy) and disbonding caused by package interaction can be assessed.
+  https://res.cloudinary.com/dy3wlzuye/image/upload/v1584490787/GideonLabs/blue-1.jpg

hugo/content/analytical-services/fourier-transform-infra-red-spectroscopy.md

@@ -4,7 +4,7 @@ title: Fourier Transform Infra-Red
 
 ## Theory of Operation
 
-{{< picture src="FTIR-1" alt="FTIR-1" >}}
+![FTIR-1](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/FTIR-1.jpg 'FTIR-1')
 
 The component atoms of polyatomic molecular groups are in constant dynamic state of motion with respect to each other. They are changing between the molecular ground state and quantum mechanically allowed excited states due to thermal excitation. This movement allows the spectroscopist to observe the twisting, bending, rotating and stretching motions of the atoms within a molecule occur at frequencies that are in the infra-red (IR) portion of the electromagnetic spectrum (0.7500 um). When infra-red light of energy coincident with the difference between the ground state and excited state of a particular molecular vibration is radiated onto a sample, the vibrations are stimulated (it jumps from the ground state to an excited state), and the light of that particular wavelength is absorbed by the molecule (IR absorbance). By monitoring the absorbance of the a range of wavelengths or frequencies of an infra-red light as it is transmitted through or reflected from (IR reflectance) a sample, a characteristic infra-red spectrum can be obtained (as above). In Fourier transform infra-red spectroscopy, the source is modulated with a Michelson interferometer. This results in a signal at the detector which has a distribution of frequencies determined by the speed of the moving mirror of the interferometer. The resulting interferogram in the amplitude time domain is then transformed via the Fourier algorithm into the appropriate amplitude-wavelength domain, resulting in a characteristic infra-red spectrum for a particular compound.
 

hugo/content/analytical-services/gcms.md

@@ -2,7 +2,7 @@
 title: Gas chromatography–mass spectrometry
 ---
 
-{{< picture src="GCMS-TIC-1" alt="gcms" >}}
+![GCMS](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/GCMS-TIC-1.jpg 'GCMS')
 
 GC analysis is a common confirmation test. GC analysis separates all of the components in a sample and provides spectral output. The sample is injected in the GC port. The GC vaporizes the sample, separates and analyzes the various components. Each component produces a spectral peak that is recorded on a paper (intensity vs retention time). The time elapsed between injection and elution is called the "retention time." The retention time differentiates the different components within the sample. The area under the peaks is proportional to the quantity of the corresponding substances in the sample analyzed. The peak is integrated to give the area under the peak. The bottom of the peak is the base line.
 

hugo/content/analytical-services/inductive-coupled-plasma-and-atomic-absorption-icp-and-aa.md

@@ -4,7 +4,7 @@ title: Inductive Coupled Plasma and Atomic Absorption
 
 ## Graphite Furnace AA (GFAA)
 
-{{< picture src="aa-55" alt="aa-55" >}}
+![aa-55](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/aa-55.jpg 'aa-55')
 
 This technique often allows for 1000-fold greater sensitivity than flame AA. Instead of utilizing a flame to atomize the sample, an electrical current is passed through a graphite tube which contains the analyte. The resonant wavelength of choice from the spectral lamp passes through the center of the graphite tube with the sample vapor. The atomized element absorbs the light energy over time. The area under the Time-Absorbance curve is most often the parameter of choice used to determine concentration by way of a calibration curve. Zeeman AA makes use of the absorbed spectral lines being split in the presence of a strong magnetic field. That splitting can be used to compensate for over two (2) units of background absorbance.
 

hugo/content/analytical-services/optical-microscopy.md

@@ -4,22 +4,20 @@ title: Optical Microscopy
 
 ## Brightfield, Darkfield and Interference Contrast (Nomarski)
 
-{{< picture src="optica1" alt="optical" >}}
+![optical](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/optica1.jpg 'optical')
 
 ### Brightfield illumination
 
 Brightfield illumination is the normal, most even illumination mode. A full cone of light is focused by the objective on the sample. The sample is uniformly illuminated. The picture observed is the result of differences in reflectivity created by material properties of the sample, transmission and reflection through surface films, and by the surface contour of the sample (see comparison above).
 
 ### Darkfield illumination
 
-{{< picture src="901-2" alt="darkfield illumination" >}}
+![darkfield illumination](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/901-2.jpg 'darkfield illumination')
 
 Darkfield illumination has the inner circle portion of the light blocked. The sample is illuminated entirely by light which impinges on the sample surface at a glancing angle. The scattered reflected light seen through the lens comes from irregular features on the surface, such as step edges, scratch edges, particulates like dust or contamination, metal precipitates, etc. The principle use of darkfield has been for detecting particles and scratches. Note that in the sample the spectral reflections from the metal disturbed by a probe are brighter than any other feature in the photo.
 
 ### Interference contrast (Nomarski)
 
-{{< picture src="huge286" alt="interference contract" >}}
-
 Interference contrast (Nomarski) is a variation of brightfield illumination. Light from the lamp is polarized. The polarized light is divided into two orthogonal polarized packets of light by a Wollaston prism located immediately before the light enters the objective lens. The two packets of light are displaced laterally very slightly as they impinge on the sample. The two packets are combined again as they pass back through the prism.
 
 The unique characteristic of interference contrast comes from the fact that each packet intersects the sample at slightly different points. If the two points on the surface are at different elevations, each light packet travels a different round trip distance from the prism to the sample and return. That difference adds or interferes as the packets are recombined in the prism. Etch pits and cracks which are not detectable in brightfield will stand out clearly enough to be photographed in interference contrast. By rotating the initial polarization, the analyst can change the interference patterns to maximize contract in specific areas of interest. Nomarski is especially good for observing the die topography on semiconductors, VLSI, memory, logic, and microprocessors. Is capable of locating point defects, line defects, twinning, stack faults, and other silicon defects.

hugo/content/analytical-services/scanning-electron-microscopy.md

@@ -4,15 +4,15 @@ title: Scanning Electron Microscopy (SEM)
 
 ## Operation
 
-{{< picture src="Hitachi4500" alt="Hitachi 4500 SEM" >}}
+![Hitachi 4500 SEM](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/Hitachi4500.jpg 'Hitachi 4500 SEM')
 
 Under high vacuum (10-6 Torr), an electron beam varying in intensity up to 30 keV is rastered over the sample surface, creating secondary electrons. These are extracted from the sample and imaged to create a high resolution, high depth of field, secondary electron image at magnifications to 250k x. Interactions of the sample atoms with the primary electron beam also result in inner core ionization of the atoms with the subsequent emission of quantized X-ray photon. Wavelength or energy analysis of the emitted X-rays provides qualitative elemental identification (because each element radiates at a specific wavelength) and the relative intensities of these X-rays are used for quantitative analysis.
 
 In semiconductor materials, electron beam bombardment also creates electron-hole pairs, resulting in an electron beam induced current (EBIC), which can be imaged to correlate with other sample features. Various stains (over 600) and sample preparation techniques are utilized to enhance the areas of interest
 
 ## Applications
 
-{{< picture src="5600sempage" alt="5600 SEM" >}}
+![5600 SEM](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/5600sempage.jpg '5600 SEM')
 
 SEMs are used in the characterization of microstructural surface topography, step coverage, grain size, oxide slope, construction parameters, sample composition, contamination, structural defects, bonding defects, intermetallic formation and degree of wire bond deformation. Digital X-ray maps of up to eight elements may be
 
@@ -22,6 +22,6 @@ The interaction between the energetic monochromatic electrons from an impinging
 
 The electron microprobe instrument utilizes a stationary beam of electrons to excite X-rays from the sample area of interest. The X-rays are characterized by their specific wavelength with a crystal diffraction grating. The electron microprobe suffers from its selectivity and method of analysis. Various crystals are required to efficiently diffract different wavelengths of X-rays. In addition, a given crystal can diffract only one wavelength at a time. Therefore, ranging over all the wavelengths in the periodic chart is a very tedious and time consuming task. The more common instrument is an energy dispersive X-ray analyzer (EDXA) attachment to the SEM. This tool and its capabilities makes use of the known binding energy in a doped wafer of silicon, which is used as a detector.
 
-{{< picture src="5600sem" alt="5600 SEM" >}}
+![5600 SEM](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/5600sem.jpg '5600 SEM')
 
 The generated X-rays impinge on the silicon detector surface. The silicon is doped with lithium. The penetration depth of the X-ray into the silicon is a direct function of the energy of the X-rays. Interactions occur along the penetration track between the X-rays and the silicon atoms creating hole-electron pairs. The generation of each hole-electron pair requires a specific amount of energy. Therefore a weak X-ray of a shallow penetration depth will generate a smaller current pulse than a more energetic X-ray of a longer penetration track.

hugo/content/analytical-services/thermal-analysis.md

@@ -4,7 +4,7 @@ title: Thermal Analysis
 
 ## Application
 
-{{< picture src="tg209" alt="thermal analysis" >}}
+![Thermal analysis](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/tg209.jpg 'Thermal analysis')
 Thermal analysis is used to characterize materials by measuring physical and reactive properties as a function of temperature. Temperature range becomes one of the most important criteria when considering such applications as the transportation industry, 3rd rail where voltage spikes and current are high for short durations, and electronic equipment exposed to the elements. Matching the materials in electronic packaging, polymer potting, and encapsulation is important to ensure product integrity in these environments.
 
 Thermal analysis (TA) offers the ability to evaluate and compare materials. The information TA provides includes:

hugo/content/analytical-services/x-ray-diffraction.md

@@ -4,11 +4,11 @@ title: X-Ray Diffraction
 
 ## Description of Technique
 
-{{< picture src="IMG_20180131_114409" alt="x-ray diffraction" >}}
+![x-ray diffraction](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/IMG_20180131_114409.jpg 'x-ray diffraction')
 
 X-ray diffraction (XRD) takes advantages of the coherent scattering of x-rays by polycrystalline materials to obtain a wide range of structural information. The x-rays are scattered by each set of lattice planes at a characteristic angle, and the scattered intensity is a function of the atoms which occupy those planes. The scattering from all the different sets of planes results in a pattern which is unique to a given compound. In addition, distortions in the lattice planes due to stress, solid solution, or other effects can be measured. An additional advantage of XRD is that it is a non-destructive technique, and that there are no requirements on the sample other than its surface be planar and that it be polycrystalline.
 
-{{< picture src="xrdfile" alt="xrd" >}}
+![xrd](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/xrdfile.jpg 'XRD')
 
 - Both quantitative and qualitative data can be obtained. Quantitative analysis requires that the customer supply reference standards of the individual constituents in the mixture.
 - Inorganic compounds which have known reference patterns. Limited capabilities for structure determination of compounds whose crystal structure is unknown.

hugo/content/analytical-services/x-ray-radiography.md

@@ -2,7 +2,7 @@
 title: X-Ray Radiography
 ---
 
-{{< picture src="IMG_5279" alt="Radiography machine" >}}
+![Radiography machine](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/IMG_5279.jpg 'Radiography machine')
 
 ## Nordson Dage XD7600NT Diamond Radiography
 
@@ -25,13 +25,13 @@ Gideon has the latest XD7600NT Diamond X-ray inspection system, the ultimate cho
 - 70° Oblique Views without Loss of Magnification
 - AXiS - Active X-ray Image Stabilization
 
-{{< picture src="IMG_5285" alt="Radiography internal unit" >}}
-{{< picture src="die-2" alt="die 2" >}}
-{{< picture src="die-3" alt="die 3" >}}
-{{< picture src="5-bad1" alt="5-bad1" >}}
-{{< picture src="2pcb-resistor-1" alt="2pcb-resistor-1" >}}
-{{< picture src="2diode-3" alt="2diode-3" >}}
-{{< picture src="good" alt="good" >}}
-{{< picture src="test1" alt="test1" >}}
-{{< picture src="die-43" alt="die-43" >}}
-{{< picture src="tvl1-21" alt="tvl1-21" >}}
+![Radiography internal unit](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/IMG_5285.jpg 'Radiography internal unit')
+![die 2](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/die-2.jpg 'die 2')
+![die 3](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/die-3.jpg 'die 3')
+![5-bad1](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/5-bad1.jpg '5-bad1')
+![2pcb-resistor-1](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/2pcb-resistor-1.jpg '2pcb-resistor-1')
+![2diode-3](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/2diode-3.jpg '2diode-3')
+![good](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/good.jpg 'good')
+![test1](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/test1.jpg 'test1')
+![die-43](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/die-43.jpg 'die-43')
+![tvl1-21](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/tvl1-21.jpg 'tvl1-21')

hugo/content/categories/resistor-failure-analysis/_index.md

@@ -3,7 +3,9 @@ name: Resistor Failure Analysis
 title: Resistor Failure Analysis
 ---
 
-{{< picture src="resist5" alt="resistor diagram" >}}
+![resistor diagram](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/resist5.jpg 'resistor diagram')
+
+# Table
 
 | Number | Name            | Material                   |
 | ------ | --------------- | -------------------------- |

hugo/content/for-sale/tph-170-pfeiffer-balzers.md

@@ -4,11 +4,11 @@ title: TPH 170 Pfeiffer Balzers
 
 The pump below is a TPH 170 Pfeiffer Balzers. The S/N is PMp01210AF0475 We are selling it with the power supply. It is 170l/s, 2x6ml and weighs 7.3 Kg. The one above it is a TPH 100.
 
-{{< picture src="IMG_20180131_144638" >}}
-{{< picture src="IMG_20180131_144658" >}}
-{{< picture src="TPH170-1" >}}
-{{< picture src="TPH170-2" >}}
-{{< picture src="TPH170-ps" >}}
-{{< picture src="TPH170-ps-1" >}}
-{{< picture src="TPH170-ps-2" >}}
-{{< picture src="TPH170-ps-3" >}}
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/IMG_20180131_144638.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/IMG_20180131_144658.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/TPH170-1.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/TPH170-2.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/TPH170-ps.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/TPH170-ps-1.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/TPH170-ps-2.jpg)
+![](https://res.cloudinary.com/dy3wlzuye/image/upload/f_auto,c_scale,w_300/GideonLabs/TPH170-ps-3.jpg)